Application Fields
Optical Materials
- Glass
- Crystals
Acoustic Materials
- Piezoelectric Ceramics
- Piezoelectric Crystals
Photovoltaic/Semiconductor Materials
- Monocrystalline Silicon
- Polycrystalline Silicon
- Silicon Carbide
Other Materials
- Oxide Crystals
- Ceramic Materials (Silicon Nitride, Boron Carbide)
- Aluminum Oxide
- Zirconium Oxide
Main Functions
This equipment is primarily used for cutting various hard and brittle materials including monocrystalline silicon, polycrystalline silicon, silicon carbide, ceramics, and magnetic materials. Through high-precision cutting, it improves work efficiency and reduces material loss.
Maximum Workpiece Cutting Size: 230mm × 250mm × 180mm
Machine Weight: 7,500 kg
Key Features
- Robust Construction: Machine body adopts cast and forged components for excellent stability
- Precision Control: Equipped with internationally renowned servo drivers for high control accuracy and fast response speed
- High-Efficiency Cutting: Cutting speed up to 2,500 m/min
- User-Friendly: Humanized operation interface, intelligent and convenient
- Durable Finish: Equipment surface treated with imported paint, no peeling or fading
- Versatile Design: Feed worktable with ±6° rocking design, suitable for ultra-hard and brittle material processing
Technical Specifications
| No. | Parameter | Specification |
|---|---|---|
| 1 | Maximum Workpiece Length (mm) | 230 |
| 2 | Maximum Workpiece Width (mm) | 250 |
| 3 | Maximum Workpiece Height (mm) | 180 |
| 4 | Wire Running Direction | Forward and Reverse Bidirectional |
| 5 | Wire Diameter (mm) | 0.04 – 0.25 |
| 6 | Worktable Cutting Feed Speed | 0.1 – 6 mm/min |
| 7 | Worktable Rapid Feed Speed | 0 – 360 mm/min |
| 8 | Maximum Wire Speed (m/min) | 3000 / 1800 / 1200 |
| 9 | Shaft Roller Diameter (mm) | 230 |
| 10 | Tension Range (N) | 3 – 60 |
| 11 | Total Power Consumption (kW) | ≤ 65 |
| 12 | Power Supply | AC 380V |
| 13 | Main Unit Dimensions L×W×H (mm) | 3250 × 1950 × 2510 |
| 14 | Total Machine Weight (kg) | Approx. 7,500 |