Advanced semiconductor wafer dicing solutions

A diamond wire saw cutting machine is an industrial tool that utilizes a very thin and flexible wire strand with diamond crystals embedded on it to penetrate hard and fragile materials. The wire moving back and forth at a very high speed simultaneously with the workpiece being pushed gently into the cutting area results in very clean and accurate cuts with hardly any material loss (kerf loss) when compared to the conventional methods of blade cutting.

Diamond wire saws can be used efficiently to cut through hard and brittle materials such as silicon wafers, silicon carbide (SiC), sapphire, quartz, ceramics, graphite, glass, composite materials, magnetic materials, stone (marble, and granite), concrete, and the different kinds of crystals used in semiconductor and optical applications.

Loop wire cutting machines are designed for cutting out irregular shapes, contours, and single cuts using a continuous diamond wire loop. In contrast, multi-wire saw machines are equipped with a number of parallel wires that are placed on rollers and cut many slices from a workpiece at the same time. This technology is perfect for high-volume wafer production with uniform thickness.

Kerf loss reduction can be attained by employing thinner diamond wire diameters (as fine as 0.04mm), optimizing processing parameters (wire speed, tension, feed rate), maintaining accurate wire tension control, utilizing proper coolant flow, and picking the right wire specification for your material. Our machines are capable of achieving kerf widths as low as 60μm.

TTV (Total Thickness Variation) is a parameter that evaluates how different the thickness of a wafer is across its surface and the lower the TTV level the better the performance and higher the yield of the corresponding semiconductor. With our precise guide wheel systems and live tension control we are able to reach superb TTV values hence preventing any downstream processing need and increasing overall yield rates.

Wet cutting involves the use of a coolant (generally, water-based) to take care of the heat generated during the process, transport the chips away, and prolong the life of wire—very suitable for hard materials such as silicon and sapphire. The dry cutting method is adopted for the materials that cannot be hydrated e.g. certain ceramics and graphite. Our machines are capable of switching to either mode based on your application needs.

Donghe Science is certified in good quality management practices as per ISO 9001:2015, has obtained CE certification for compliance with European market requirements, and has passed SGS testing certification. In addition to that, we have 35 national patents including 4 invention patents, 25 utility model patents, 4 design patents, and 2 software copyrights, showing that we are committed to innovation and quality.