Top Wafer

Double Side Lapping Machine

Double side lapping machine works both sides of wafer to enhance the flatness thickness uniformity surface quality of wafer.

Product Parameters

Type	Thinning machine	Weight	4000（kg）
Main motor power	7.5（kw）	Dimensions	2500x4500x1800（mm）
Machining accuracy	High precision	Control Method	CNC
Application scope	Dedicated	Applicable Industries	Semiconductor
Layout form	Vertical	Installation Method	Floor-standing
Target object	Wafer	Product Type	Brand New
Rated power	7.5kw/11KW	Model	200A/300A
Rated speed	1000-7000/1000-4000	TTV	≤2um/≤3um

Product Features

1. This series of equipment is a fully automatic wafer grinding machine independently designed and manufactured by our company. It boasts mature technology, stable performance, and can completely replace imported brands.

2. Advanced processing systems and design features contribute to high throughput and high yield.

3. Standard configuration includes contact-type online thickness measurement; non-contact NCG (non-contact) is also available as an option.

4. An LCD touchscreen graphical user interface makes operation and maintenance more intuitive and simple.

5. Breakthrough in core technology, we have independently developed a high-power hydrostatic air-bearing spindle and load-bearing platform.

6. The use of a marble base and marble air-bearing turntable greatly improves the overall stability of the equipment.

7. Capable of grinding various wafers from 3 to 12 inches.

Product Structure

High accuracy double side lapping machine for ultra-thin silicon wafers

This machine mainly consists of a vacuum chuck, chuck spindle, chuck drive mechanism, grinding wheel, grinding wheel spindle, grinding wheel and servo drive motor, grinding wheel feed mechanism system, and a fully closed-loop control system.

1. The grinding wheel diameter is 312mm, and the grinding wheel uses a diamond grinding wheel. The grit size of the grinding wheel is customized according to the customer's process requirements.

2. The grinding wheel spindle is a precision rotary spindle, driven by a frequency converter. The speed can be adjusted according to different process requirements via a PLC-controlled drive mode.

3. This machine uses a high-precision lead screw and guide rail assembly, driven by a servo fully closed-loop control system. The lead screw speed, i.e., the grinding wheel feed speed, can be adjusted according to different workpiece materials and process requirements via a PLC-controlled drive mode. Feed accuracy is controlled and detected by a high-resolution optical scale.

FAQ

Q1：What is the benefit of double-side processing?

A: Flatness and thickness uniformity is improved, efficiency is increased.

Q2：What wafer size can be processed?

A: The common size can realize 6”,8”,12”

Q3：How much accurate is the thickness control?

A: Thickness uniformity is realized with high precision.

Q4： Can it be used in high-volume production？

A: It is applicable to continuous stable operation in industry.

Q5： Can it be customized?

A: Yes, according to different production requirements configuration.

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