Using pure water, acidic solutions, or organic reagents as cleaning agents, and employing cleaning methods such as spraying and hot immersion, wafers are cleaned in batches. This effectively prevents water and acid leakage caused by welding aging. The equipment can be customized according to customer requirements and is equipped with wafer rackless cleaning technology, high-capacity scheduling technology, IPA drying technology, and post-chip thinning cleaning and drying technology, resulting in good cleaning effect and high cleaning efficiency. The equipment is mature and stable, with a wafer breakage rate of less than one in ten thousand.