Top Wafer
Wire Saw Machine
This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon rods with diameters compatible with 8-inch and 12-inch wafers, and a maximum processing length of 450mm (crystal orientation angle ≤4°). It features low silicon loss, high processing quality, high cutting efficiency, and good stability.
Wire Saw Machine
Product Parameters
| Applicable Industries | Semiconductor silicon wafers | Worktable Dimensions | 460*550 |
| Table Stroke (X*Y) | 320*400mm | Z-Axis Travel | 300mm |
| Maximum Cutting Thickness | 1000（mm） | Maximum Load Capacity | 300kg |
| Main Unit Weight | 1000kg | Maximum Machining Speed | 120（mm/min） |
| Surface Roughness | Ra0.8（um） | Maximum Power Consumption | 2KW |
| Input Voltage | 380V50HZ | Electrode Wire Diameter Range | 0.16-0.42mm |
| Table Weight Capacity | 400 | Machine Tool Guideways | Ball bearing rails, linear guides |
| Control System | Dedicated CNC system | Wire Feed Speed | 0-15m/s |
| Maximum Cutting Angle/Workpiece Thickness | 350 | After-Sales Service | 1 years |
Wire Saw Machine
Product Features
Zero-Contact Cutting
Non-contact cutting, no physical contact, avoiding material damage and contamination.
Micron-Level Precision
High-precision cutting path (<20µm), smooth cut surface, no chipping.
High-Speed, High-Quality Cutting
High-efficiency cutting speed, especially suitable for hard materials.
Ultra-Thin, Non-Destructive
Almost no material waste, low loss, suitable for ultra-thin wafers.
Multi-Material Applicability
Compatible with various materials and sizes, highly adaptable.
No Post-Process Cleaning Required
No cleaning required, suitable for sensitive materials.
Intelligent, Fully Automatic Control
Supports fully automatic operation, equipped with high-precision positioning and visual recognition.
Stable, Low-Maintenance Operation
Stable operation, low maintenance costs.
FAQ
FAQ
Q1: What kind of materials can be cut?
A: Primarily silicon ingots and other materials of this hardness.
Q2: Is the thickness of cut customizable?
A: Yes it is.
Q3: Does it come fully automatic?
A: There are versions that are semi-automatic as well as fully-automatic.
Q4: What are the benefits of diamond wire cutting?
A: Greater precision and less loss of material when compared to traditional cutting methods.
Related Equipment
Related Equipment
Silicon Wafer Production Line
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