Top Wafer

Silicon Wafer Grinding Machine

Wafer grinding machine is a device which controls wafer thickness and increases surface flatness. Wafer grinding machine has applications in silicon wafer production processes for thickness uniformity and defect reduction.

Product Parameters

Type	Surface grinder	Weight	2550（kg）
Main Motor Power	7.5 kW	Dimensions	160021002200（mm）
Machining Accuracy	High precision	Maximum Grinding Size	330（mm）
Control Method	CNC	Applications	General Purpose
Applicable Industries	General purpose	Layout	Vertical
Installation Method	Floor-mounted	Target Objects	Silicon Wafers, Sapphire, Optical Glass, Aluminum Alloy, Stainless Steel, Hard Alloy, Sealing Rings, Ceramics, Valve Plates, Valves, Electric Scissors, etc.
Product Type	Brand new

Product Features

1. The flatness of the grinding disc can reach 0.002mm; the flatness of workpieces with a diameter of 50mm can reach 1/4 wavelength after processing.

2. Workpiece pressurization can be achieved using a cylinder-suspended weight method, with adjustable pressure.
3. PLC program control and a touch screen operation panel are used. The grinding disc rotation speed, timing, and grinding time can be directly input on the touch screen; the speed is adjustable, making operation convenient.

4. The equipment has three workstations (including three sets of pressure weights), allowing simultaneous polishing and grinding of three sets of products.

5. Grinding fluid circulation and injection system.

Equipment Principle

Precision silicon wafer back grinding machine for semiconductor industry

1. This equipment is a precision grinding machine. The product to be ground is placed on the grinding disc, which rotates counterclockwise while the workpiece rotates on its own axis. Simultaneously, pressure is applied to the workpiece by gravity, causing relative rotational friction between the workpiece and the grinding disc to achieve the grinding purpose.

2. The grinding disc dressing machine uses a hydraulic suspension guide rail, combined with a diamond dressing blade, to precisely dress the grinding disc, resulting in a high degree of flatness.

FAQ

Q1: What sizes of wafers can this grinding machine be applied to?

A: Supported Wafer sizes:6 inch,8 inch,12 inch. Other customized sizes are available.

Q2: What's the accuracy of thickness control?

A: This thickness control is available in High precision for semiconductor industry .

Q3: Are the grinding parameters adjustable?

A: Adjustable parameters including speed, Pressure and feed rate.

Q4: Can this machine be used for mass production？

A: This machine is suitable for stable continuous industrial production.

Q5: Isinstallation and training provided?

A: We provide complete technical support including installation and operator training.

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