Top Wafer

Silicon Chamfering Machine

The wafer chamfering machine is specially used to process the edge of the wafer to remove sharp edges and to increase the strength of the edge so that cracks will not occur during further processing.

Product Parameters

Customization supported?	Yes	Minimum travel distance of vacuum disc	＜±0.01
Total equipment weight	350kg	Grinding speed	1mm/s-50mm/s
External dimensions	1740x840x980mm	Adsorption force	Better than -80 kPa
Grinding disc size	Customizable	Total power	2KW
Workpiece size	1-6inch	Main power supply	380V
Grinding wheel speed	Adjustable from 0-4500rpm	Main motor speed	0-90rpm
Wafer center positioning accuracy	≤±0.1mm	Timing range	99 hours and 59 minutes
Vacuum chuck repeatability	≤±0.01mm	Working position	Group 1

Product Features

1. A precise control system allows for accurate setting and adjustment of parameters such as cutting speed and depth.

2. Semi-automatic operation: Only manual loading and unloading are required; the equipment can automatically perform grinding.

3. High processing precision: It can precisely control the chamfer angle, size, and surface roughness.

4. Processing various wafer sizes: It can accommodate wafers of different sizes and materials, such as 1-6 inch wafers, as well as OF wafers and rounded-edge wafers.

5. Good stability: The equipment typically uses high-quality materials and advanced manufacturing processes to ensure stable operation over long periods.

Equipment Principle