Top Wafer

Silicon Wafer Polishing Machine

This equipment is a precision polishing device. The product to be polished is placed on a polishing disc, which rotates counterclockwise. The workpiece rotates with the disc, and pressure is applied to the workpiece by means of weights or cylinders. The workpiece and the polishing disc rotate and rub against each other to achieve the polishing purpose.

Product Parameters

Type	Surface Polishing Machine	Weight	750（kg）
Main Motor Power	1.5 (kW)	Dimensions	150012001300（mm）
Machining Accuracy	High Precision	Maximum Grinding Size	180（mm）
Control Method	CNC	Applications	Specialized
Applicable Industries	General Purpose	Layout	Vertical
Installation Method	Floor-standing	Target Objects	LED sapphire substrates, various ceramics, optical glass wafers, quartz wafers, silicon wafers, germanium wafers, and other materials.
Product Type	Brand New	Polishing Disc Size	460mm

Product Features

1. Variable frequency control enables soft start and soft stop, minimizing impact and reducing workpiece damage.

2. Timer function controls the process; the time and speed can be preset on the panel. The machine automatically stops when the set time is reached, allowing for better control of product dimensions.

3. The polishing machine uses a weighted pressure block for workpiece pressurization, resulting in a high-gloss surface free of scratches, marks, material lines, pitting, and edge collapse after polishing.

4. An intermittent automatic spraying device allows for freely set spray intervals, ensuring even spraying of the polishing slurry onto the polishing disc for workpiece stability. This reduces polishing time, saves on consumable costs, and meets environmental requirements.

5. A drive mechanism actively drives the workpiece disc, rotating the workpiece and improving polishing efficiency and precision.

Equipment Principle