1. What Is a Wire Saw Machine?

Wire saw machine is a kind of cutting machine which can cut brittle and hard material with wire.

The machine moves the wire to cut through the workpiece with certain speed and tension.

And with the abrasive particle on the wire it can cut material.

Nowadays we usually use diamond wire to cut material.

So the wire saw machine can cut material with small loss.

Such as:

• Cutting silicon wafer
• Cutting silicon wafer
• Cutting sic wafer
• Cutting sapphire
• Cutting glass
• Cutting ceramic
• Cutting crystal
• Cutting solar wafer
• Cutting other advanced material.

Wire saw machine can use wire to cut material, not saw blade.

So it can cut with small kerf and less loss.

This is very important for semiconductor industry.

Because silicon, sic and sapphire all cost high.

Less loss will help improve material usage rate.

2. How Does a Wire Saw Machine Work?

Wire saw machine work by controlling wire movement and feeding workpiece to cutting zone.

Here are some basic steps.

Step 1: Mount Workpiece

First we need to put our workpiece on the machine table.

Make sure the workpiece can be fixed firmly.

So it won’t move while cutting.

Step 2: Install Cutting Wire

After that we can install wire on the machine.

The machine will give the wire tension to make it tight.

Step 3: Move Wire

Then the wire will move across the cutting area.

It can move in one direction or back and forth depending on machine type.

The diamond on wire will grind off material from workpiece.

Step 4: Feed Workpiece

Machine will feed workpiece towards cutting wire.

This controls the speed that wire can penetrate into material.

Step 5: Cool and Remove Cutting Particles

We can use cutting fluid to cool down cutting area.

Also it can remove particles generated while cutting.

Step 6: Complete Cutting

The machine will keep working until it reaches preset cutting distance.

Then we can stop cutting.

And move to next process.

3. Wire Saw Machine Structure

There are some key parts on a wire saw machine.

Cutting Wire

Wire is the part that cuts off material from workpiece.

We can use diamond wire to cut hard material.

size can effect cutting kerf.

Wire Tension

Wire tension can keep the wire stable while cutting.

If we can control the wire tension well it will improve cutting quality.

So we need a good wire tension controller on the machine.

Wire Guide

Wire guide can direct the wire to correct position.

So it will help us control the cutting position.

Good wire guide can also effect the cutting quality.

Workpiece Feeding

Feeding system is used to move workpiece towards cutting area.

We usually use servo motor to control feeding speed.

So we can get a better wafer thickness.

Drive System

Drive system controls the movement of wire.

It decides how fast the wire can move.

If the process allows we can use high speed drive to improve efficiency.

Cooling System

Cooling system is used to cool down the cutting area.

It can also remove particles from cutting area.

So it will help us keep stable cutting condition.

Controller

Controller is used to control the whole machine.

We can use PLC and servo system to control the machine.

Some parameters we can control:

• Wire speed
• Feeding speed
• Wire tension
• Cutting distance
• Cutting number

4. Wire Saw Machine Type

We can use different type wire saw machine to meet different requirement.

Multi Wire Saw

Multi wire saw can use multiple wires to cut at the same time.

So it can cut multiple slots at the same time.

It has high efficiency.

Suitable for wafer manufacturing.

Such as silicon wafer, sic wafer, sapphire, glass, ceramic, crystal etc.

Single Wire Saw

Single wire saw only use one wire to cut.

So it can provide more flexible solution.

Can be used for:

• Research
• Sample making
• Small quantity production
• Special products
• Products with irregular shape

Single Wire Saw Machine

Diamond Wire Saw 

Diamond wire saw is a kind of wire saw that uses diamond wire.

can provide better cutting ability.

So it is widely used for silicon, sic, sapphire, ceramic, glass and crystal etc.

Reciprocating Wire Saw

Reciprocating wire saw can move wire back and forth to cut material.

It can provide better cutting control.

Such as Nanjing Top Wafer MW4040T-300 reciprocating grinding wire saw with diamond wire.

It can be used for monocrystalline silicon, ceramic, glass etc.

5. Wire Saw Machine for Cutting Silicon Wafer

Cutting silicon wafer is one of the main application for wire saw machine.

We can use wire saw to cut silicon rod into thin wafer.

So it is very important to have a good wire saw machine.

Some factors we need to pay attention to:

• Wafer thickness
• TTV
• Loss
• Surface roughness
• Cutting speed
• Wire tension
• Wire diameter
• Feeding speed

All these can effect our final wafer quality.

So we need to control the machine to get a better result.

After wire saw we can move to grinding.

Then polish, clean and inspect our wafer.

So wire saw is one of the key process to produce wafer.

Nanjing Top Wafer wire saw machine is used for semiconductor single crystal silicon wafer cutting.

It can be used for 8″ and 12″ silicon rod.

6. Diamond Wire Saw Machine

Diamond is very hard so it can cut material with small loss.

Compared with normal cutting method it can provide smaller kerf.

So we can use it to cut thin material.

Especially for some advanced material we can use diamond wire to cut.

Diamond wire can be used for:

• Mono silicon
• Poly silicon
• Sic
• Sapphire
• Quartz
• Glass
• Ceramic
• Crystal etc

Wire diameter is also important.

We can use smaller wire to reduce loss.

But smaller wire needs better control.

So we need to find a balance point.

Nanjing Top Wafer list some configuration for silicon wafer wire saw with wire diameter from 0.04mm to 0.12mm.

Can be used for 2″ to 12″ wafer.

7. Material Can Be Cut by Wire Saw Machine

Wire saw machine can be used to cut many material.

Silicon

Silicon is one of the most important material we can cut with wire saw.

It can be used for semiconductor and PV wafer.

Silicon Carbide

Silicon carbide is hard and has good heat resistance.

So we need to use wire saw to cut it with high precision.

Sapphire

Sapphire can be used for many application.

We can use diamond wire to cut sapphire.

Glass

We can cut different type of glass with wire saw.

Including some special glass.

Ceramic

Ceramic is hard to cut with normal tool.

So wire saw can be another choice to cut ceramic.

Crystal

We can use wire saw to cut crystal.

It can be used for research and production.

Nanjing Top Wafer list some application that can be used for glass, crystal, ceramic, silicon, sic, sapphire etc.

8. Wire Saw Machine Parameter

Here are some parameter you should know when choosing a wire saw machine.

Wire Diameter

Wire diameter can decide your kerf size.

If you want less loss you can choose smaller wire.

But you need to control the cutting process well.

Wire Speed

Wire speed can effect your cutting efficiency.

If the process allow you can use higher wire speed to improve efficiency.

But you need to find the right speed for your material and wire.

Wire Tension

Wire tension is used to control the wire.

If the tension is too low the wire may bend.

If the tension is too high it may damage the wire.

So we need to control the wire tension properly.

Feeding Speed

Feeding speed controls how fast the workpiece move to cutting area.

You need to find a proper feeding speed for your application.

Cutting Accuracy

Different application needs different accuracy.

If you are cutting wafer you need high accuracy.

So you need to find a machine with good accuracy.

Surface Roughness

Your cutting process will decide the surface roughness.

If you can get better roughness you can save some process later.

TTV

TTV stands for Total Thickness Variation.

It can describe how much thickness variation you have on your wafer.

So it is also one of the parameter you should care about.

Nanjing Top Wafer list some configuration for silicon wafer wire saw with TTV≤5μm.

9. Benefits of Using Wire Saw Machine

Wire saw machine has some benefits over other cutting method.

1. Less Loss

Wire can cut with smaller kerf.

So we can reduce loss while cutting.

2. Better Cutting Accuracy

Wire saw can control the cutting process well.

So it can cut material with high precision.

3. Can Cut Hard Material

With diamond wire we can cut material that is hard to cut.

Like silicon, sic, sapphire and ceramic.

4. Better Surface Quality

If we control the process well we can get better surface quality.

Which will help us reduce process later.

5. High Efficiency

Multi wire saw can cut multiple slot at the same time.

So it is suitable for mass production.

6. Application Flexibility

We can use different wire and process to cut different material.

So one machine can be used for many application.

10. Wire Saw Machine Vs Other Cutting Method

Wire saw machine is different from other cutting method.

Here is a comparison:

As you can see wire saw can provide smaller kerf.

So it is good if you want to reduce loss while cutting.

Especially for semiconductor industry.

11. Application of Wire Saw Machine

Wire saw machine can be used in many industry.

Semiconductor Industry

We can use wire saw to cut silicon and other wafer material.

So it can help us produce wafer.

PV Industry

We can use wire saw to cut solar wafer.

It needs high efficiency to meet the demand.

Power Industry

We can use wire saw to cut sic wafer.

Which can be used for power semi conductor.

Sapphire Industry

Sapphire substrate need high precision processing.

We can use wire saw to cut sapphire.

Ceramic

Ceramic is hard and brittle.

So we can use wire saw to cut it.

Research

Single wire saw can be used for research.

You can change your process to fit your material.

12. How to Select Wire Saw Machine

When you select a wire saw machine you need to think about more than just price.

First you need to know what material you are going to cut.

If you are cutting silicon you can use diamond wire saw.

If you are cutting sic you may need a more accurate machine.

Sapphire can also be cut with diamond wire.

Ceramic need high precision wire saw.

After that you need to know the size of your workpiece.

Then you can decide what thickness you need to cut.

If you need high quantity you can use multi wire saw.

If you need flexible production you can use single wire saw.

Then you can look at:

• Wire diameter
• Wire speed
• Wire tension
• Feeding speed
• Accuracy
• TTV
• Surface roughness
• Auto function
• Cooling system
• Maintenance

All these will help you find the right machine for your process.

13. Wire Saw Machine for Semiconductor Industry

If you are producing wafer you need high precision machine.

So you need to make sure your wire saw can provide stable cutting.

Here is a normal wafer process:

Grow Crystal – Cut Rod – Wire Saw – Grind – Polish – Clean – Inspect

Wire saw is used to cut your ingot into wafer.

Then we can grind it to make it flat.

Polish will give you a smooth surface.

Clean will remove dirt on wafer.

Inspect will make sure your wafer meet specification.

So wire saw machine is very important for your wafer process.

You may also need to control:

• Thickness
• TTV
• Bow
• Warp
• Roughness
• Loss
• Edge

All these will decide your final wafer quality.

14. Nanjing Top Wafer Wire Saw Machine

Nanjing Top Wafer Precision Equipment Co., Ltd is a wafer equipment manufacturer located in Nanjing China.

We provide complete line solution and single machine for wafer production.

Our wire saw can be used for different application.

• Wire Saw Machine

• Multi Wire Saw

• Single Wire Saw

• Diamond Wire Saw

• Silicon Wafer Wire Saw

Our wire saw machine is designed for cutting single crystal silicon wafer.

It can be used for 8″ and 12″ application.

And provide stable cutting parameter for wafer cutting.

Our high tech solution can also be used for silicon, sic and sapphire cutting.

So you can use our machine to cut different material.

Nanjing Top Wafer Wire Saw Machine

15. Wire Saw Machine Maintenance

Maintenance is important for your wire saw machine.

First you need to check your wire.

If your wire is broken or worn out it will effect your cutting.

Check your wire tension.

If the tension is not right your wire may vibrate or bend.

Check your wire guide.

If your guide is worn it may not hold your wire correctly.

You also need to check your cooling system.

Make sure your cooling system is working well.

Such as:

• Flow
• Filter
• Pump
• Cooling liquid

Your linear and moving parts also need maintenance.

Check your sensor and control system.

By doing these you can reduce down time and get stable cutting quality.

Home

16. FAQ About Wire Saw Machine

l What is wire saw machine?

Wire saw machine is used to cut material with wire.

It can cut hard and brittle material.

l What can wire saw machine cut?

Wire saw can cut silicon, sic, sapphire, glass, ceramic, crystal etc.

l What is diamond wire saw?

Diamond wire saw use diamond wire to cut material.

It can be used for silicon, sic and sapphire.

l What is the difference between wire saw and blade?

Wire saw use wire to cut material.

Blade use saw blade to cut material.

Wire saw can cut with smaller kerf.

l Can wire saw be used for silicon wafer?

Yes.

Wire saw is widely used for silicon wafer cutting.

l What is multi wire saw?

Multi wire saw use multiple wire to cut material.

It can cut multiple slot at the same time.

l What is single wire saw?

Single wire saw only use one wire to cut.

It can provide more flexible solution.

l Can wire saw cut sic?

Yes.

We can use diamond wire to cut sic.

But you need to use the right parameter and machine.

l Can wire saw cut sapphire?

Yes.

Diamond wire saw can be used to cut sapphire.

l How does wire diameter effect cutting?

Wire diameter will decide your kerf size.

Smaller wire can give you less loss.

But you need to control your process well.

l What is TTV?

TTV is total thickness variation.

It can tell you how much variation you have on your wafer.

So it is important for wafer cutting.

l How to choose a wire saw machine?

You need to know your material, size, thickness, quantity, accuracy, wire diameter, auto function and maintenance.

17. Summary

Wire saw machine is used to cut material with wire.

It can control the wire to cut through material.

With diamond wire we can cut many advanced material.

Now it is widely used for:

• Semiconductor wafer
• Silicon
• Sic
• Sapphire
• Ceramic
• Glass
• Crystal
• PV material

Multi wire saw can be used for high efficiency production.

Single wire saw can be used for flexible production.

So you can choose the right machine for your application.

Wire saw machine is one of the important process to produce wafer.

If you can control your tension, feeding, wire speed and position well.

You can get a good cutting result.

Nanjing Top Wafer provide wire saw machine for semiconductor and advanced material cutting.